Process Capabilities

PCB Process Capability
Series	Item	Technical Sepecification
1	Maximum layer Count	36 layer
2	TG	Ordinary TG，Halogen-free，Middle to high TG， FR4， High frequency and high speed circuit board
3	Major laminate Suppliers	KB shengyi,ITEQ,Nan Ya
4	Board thickness	0.3MM-4.0MM
5	Board thickness range	0.3-0.6MM+/-0.075MM 0.65-1.0MM+/-0.1MM >1.0MM+/-0.1MM
6	Board thickness size	>=1.6MM 580650MM >=1.0MM 546650MM >=0.6MM 300650MM <0.6MM 150300MM
7	Types of surface finish	OSP HASL,LF-HASL,Immersion Gold/Tin/Silver, Hard gold plating
8	Min Hole Size(Drill)	0.15MM
9	Copper thickness	Inner and outer layer 5OZ
10	Hole range(Drill)	PTH/NPTH：+/-0.05MM, conventional:+/-0.075MM
11	Maximum Plated Hole Aspect Ratio	Through hole 8/1
12	Minimum wire diameter/Line spacing(inner layer)	2.5/2 mil
13	Minimum wire diameter/Line spacing(outer layer)	3/3 mil
14	Impedance tolerance	:+/-0.1
15	Minimum window opening for solder mask	2 mil
16	Solder mask alignment tolerance	30um
17	Minimum solder mask bridge	3 mil
18	Plate bending,Distortion	<=0.5%
19	CNC gong plate tolerance	:+/-0.1MM
20	Minimum BGA pad	0.2MM
21	Minimum BGA spacing	>=0.2MM
22	HDI structure	Level 1-2 HDI
23	Minimum laser aperture	0.1MM
24	Minimum mechanical drilling diameter	0.15MM

Metal substrate Process Capability
Series	Item	Technical Sepecification
1	Product categories	aluminum substrate，copper substrate，iron substrate，ceramic substrate
2	Number of layer	1-4ayer
3	Surface Treatment	Tinspraying, OSP, gold plating,nickel palladium, silver plating
4	Maximum machining size	1500MM*600MM
5	Minimum machining size	5MM*5MM
6	Minimum line width/line spacing	0.1MM/0.1MM
7	Sheet warping degree	<=0.5%
8	Board thickness processing range	0.2MM-5MM
9	Copper foil c range	18UM-210UM
10	Forming tolerance	Die CNC+/-0.1MM, plus or minus 0.1MM
11	V-CUT dimensional tolerance	:+/-0.15MM
12	Hole copper thickness range	More than 20 UM
13	Pore size tolerance	:+/-0.05MM
14	Minimum hole diameter	Three-quarters of thickness or higher
15	Half pit aperture range	Aluminum 0.8MM-6.5MM, copper 0.8MM-4.0MM
16	Countersunk head aperture range	1.2MM-10MM
17	V-CUT board thickness range	Aluminum 0.4MM-3.5MM, copper 0.6MM-3.0MM
18	Exposure offset	:+/-0.075MM
19	Minimum screen pringting character width(character thickness）	0.15MM
20	Minimum screen pringting character Height(overall height）	0.8MM
21	Minimum resistance welding window opening	0.2MM
22	Minimum punching diameter	1.5MM
23	Minimum slot size	2MM*3MM
24	Punching distance from hole to edge	More than 1.0MM
25	length of connecting bit of connecting board	More than 5MM
26	Blanking thickness range	0.2MM-4MM
27	Voltage safe distance	Distance from wire to edge(hole)/withstand woltage =1.2MM/AC1000V
28	Maximum Voltage resistance of the material	AC10000V